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JC power device test socket T4P-L214-ST- JC Electronics Catalog
JC power device test socket T4P-L214-ST-BK semiconductor SiC/GaN MOSFET mounting fixture dynamic / static parameters precision evaluation for TO-247-4 package
  • JC power device test socket T4P-L214-ST-BK semiconductor SiC/GaN MOSFET mounting fixture dynamic / static parameters precision evaluation for TO-247-4 package

JC power device test socket T4P-L214-ST-BK semiconductor SiC/GaN MOSFET mounting fixture dynamic / static parameters precision evaluation for TO-247-4 package

Brand: JC Electronics

Origin: Japan

Fixtures & Accessories. Detailed specifications are available in the product datasheet.
Overview

Using our JCx series high-reliability test sockets and dedicated fixtures, the full performance potential of SiC/GaN MOSFETs can be released as much as possible during measurement.

The fixtures use dedicated connectors and device fixing materials in collaboration with Japan's ]℃ Corporation, suitable for stable evaluation of the static parameters of various DIP and SMD devices under normal and high/low temperature conditions.

Using low-inductance test sockets for dynamic parameter evaluation can achieve excellent stable data.


Accurately evaluating the performance of TO-3P and TO-247 packaged power devices with JCx is crucial for development and manufacturing. Our test sockets provide innovative technology and high reliability,

maximizing the performance of MOSFETs built with next-generation semiconductor materials such as SiC (silicon carbide) and GaN (gallium nitride).

Our sockets are designed for semiconductor static parameters, dynamic switching parameters, and device HTRB reliability testing,

maintaining stable electrical and mechanical integrity even under harsh conditions.


High-speed switching signal - low Ls and Kelvin precision measurement. Our test sockets are designed to fully extract the high-speed switching performance of devices and achieve accurate evaluation.

Our sockets use standard Kelvin connections to isolate the current measurement path from the voltage sensing path. This eliminates the impact of wiring and contact resistance on voltage drop,

ensuring highly accurate measurements.


Surface-mount power device test sockets: high/low temperature, high reliability, high voltage, high current, low inductance in the SiC/GaN era.

We offer a variety of test sockets compatible with new surface-mount packages attracting industry attention, such as TOLL, ODPAK, R2PAK, and HU3PAK.


Through-hole mounted DIP power device test sockets

Through-hole mounted power device test sockets: compatible with TO-247-4L, TO-3P, etc. We offer a comprehensive range of high-performance test sockets compatible with through-hole mount packages such as TO-247-4L and TO-3P.

Our sockets use Kelvin connections to accurately evaluate the high-speed switching performance of MOSFET chips in packages such as TO-247-4L.


Additionally, we also offer products designed for high performance capable of handling up to 50A DC current.


Specifications

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* Specifications are subject to change without notice.