PHS-100/200/500 Junction-Temperature (Tj) Test Systems for Power Devices and Modules

The first junction temperature monitoring technology applied to Si-based IGBTs was born By the end of the 20th century [11]. Today, such technologies have developed over 30 years Maturity. However, only a dozen SiC MOSFETs have been put into industrial use Its characteristics are quite different from those of Si-based IGBTs, so traditional junction temperature monitoring is required Control technology is difficult to applicable. SiC MOSFET junction temperature monitoring technology is in the In the early stages of development, the relevant theoretical systems were still lacking and incomplete, and related experimental and verification instruments and equipment were seriously lagging behind

The PHS-100/200/500 series power device junction temperature simulation testing system is a junction temperature simulator developed by Jiechuang Instruments to meet various packaging requirements for devices and modules. Through highly stable PID temperature control, advanced adaptation fixtures, and electrical parameter calibration + PID temperature control compensation, it achieves efficient and precise Tj application

The PHS-100 series high-stability temperature control system is a professional-grade power device junction temperature temperature control adaptation device independently developed by Jiechuang Instruments. It consists of THF series multi-type package fixtures, TCU multi-channel temperature control units, and EasyCon upper-level software

The professional-grade PHS-200 and expert-grade PHS-500 will offer a wider temperature range and electrical parameter analysis capabilities

The PHS-100 features industry-leading high stability, temperature control accuracy better than ±0.2°C, and the entire system uses standard signal interfaces, supporting multi-channel expansion and multi-package compatibility. It is mainly designed for advanced SiC and GaN packaged power devices and modules, providing precise high and low temperature junction temperature simulation environments, making it especially suitable for static I-V parameters of power devices and dynamic dual-pulse high-temperature and high-low temperature applications. The extended system also supports device thermal resistance analysis, HTRB, HTGB, H3TRB, and other reliability analyses

PHS-100 series model lineage and performance features:

• PHS-100S single-channel temperature control unit

• PHS-100D dual-channel temperature control unit

• PHS-100N *1 multi-channel temperature control unit (up to 8CH).

PHS-100 parameter performance indicators

• Temperature range: RT-205°C

• Number of channels: 1CH, 2CH, 3~8CH

• temperature control accuracy: ±0.2 °C (steady state

).

• thermal uniformity: ±1 °C (within load plane).

• communication: supports Modbus-485

• comes standard with EASYCON host computer software for remote control

• Universal fixture interface, supports mixed use of DIP packages and TOLL and other SMD packages

• supports power module fixtures and other optional parts

• supports upgrading to high and low temperatures of -40/205°

  C

  
  

PHS-200P Professional series models

• PHS-200S single-channel high-power temperature control unit

• PHS-200SP single-channel SMU high-power temperature control unit

• PHS-200D dual-channel high-power temperature control unit

• PHS-200DP dual-channel SMU high-power temperature control unit

• PHS-200Nx *1 multi-channel high-power temperature control unit (up to 8CH).

• PHS-200NxP dual-channel SMU high-power temperature control unit

supports maximum measurement size of 160*85mm, with better temperature uniformity than ± 1.5°C

Professional version: Built-in high-precision SMU module, supports high-stability current and voltage sampling via transistor voltage drop calibration Tj temperature